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Supercritical cleaning machine

The Company has committed to the field of supercritical fluid extraction equipment for 30 years.

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Laboratory small extraction equipment

Category:

Chip cleaning

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Supercritical cleaning machine

A series of highly efficient, precise, and energy-saving cleaning equipment and solutions have been launched for pre-treatment of semiconductor chip bonding, pre-treatment of encapsulation, photoresist removal, metal bonding, and pre-treatment:

Serial Number	Main Configuration	Parameters
1	Cleaning Chamber	Size: Customized according to customer requirements, able to meet the cleaning process needs of various sizes of wafer trays (2, 4, 6, 8, 12 inches). Pressure: Adjustable from 35MPa to 50MPa, Temperature: Adjustable from room temperature to 200℃, Wafer speed: Adjustable from 0-3000 rmp, maintaining the balance, stability, and safe fixation of the wafer during high-speed rotation; Multi-layer structure: Can simultaneously clean multiple wafers (no less than 3). Observation window: Allows observation of the working status inside the cleaning chamber, Supercritical fluid can be simultaneously distributed to each wafer.
2	Pre-mixing Vessel	Capacity: Customized according to the cleaning chamber Pressure: Adjustable from 35MPa to 50MPa, Temperature: Adjustable from room temperature to 200℃, Vessel structure customized according to customer requirements
3	Collector	Capacity: Customized according to the cleaning chamber Pressure: Adjustable from 10MPa to 20MPa, Temperature: Adjustable from room temperature to 200℃, Vessel structure customized according to customer requirements
4	Purification and Filtration	Pressure 16MPa
5	Pump	CO2 high-pressure pump and entrainment pump, adjustable flow rate and pressure Configured according to the cleaning process
6	Refrigeration System	5℃-10℃
7	Safety System	High-pressure pumps and all container inlets and outlets are equipped with overpressure protection devices, safety interlock devices connected to the PLC control system and safety valves to ensure system safety
8	PLC Control System	All equipment can be configured with a PLC control system, automatically controlling the extraction and separation pressure and flow rate, temperature, and other parameters
9	User-provided	1. CO2 gas source (food grade >99.9%) 2. Water source (deionized water) 3. Refrigerant (ethylene glycol)